Abstract
Defect introduction and process variations commonly observed in conventional rapid thermal processing (RTP) systems have impeded its widespread acceptance in manufacturing. The main problem lies in the conventional approach of using scalar control, where optimal steady-state temperature uniformity at one set of processing conditions is used to fix the hardware geometry, leaving only one input variable-the lamp power-for control. It is demonstrated that this control is inadequate, since the radiative and convective heat exchange at the wafer are functions of the processing conditions, and that the resultant nonuniformity can be corrected by dynamic control of the spatial optical flux profile. Such control is demonstrated through two key innovations: a lamp system in which tungsten-halogen point sources are configured in three concentric rings to provide a circularly symmetric flux profile, and multivariable control whereby each of the three rings is independently and dynamically controlled to provide for control over the spatial flux profile. This approach offers good temperature uniformity over transients, thus improving reliability of individual processes.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
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