Abstract
Click to increase image sizeClick to decrease image sizeIn this study, micro heat pipe arrays etched into silicon wafers were investigated, for electronic cooling purposes. Micro heat pipes of triangular cross-section (230 µm width) and with liquid arteries were fabricated by wet anisotropie etching in a KOH solution. The microchannels were closed by molecular bonding of a plain wafer with the grooved one. Two test benches were developed for the micro heat pipe filling and thermal characterisation. The temperarure profile at the silicon surface was deduced from experimemal measurements and a 3D numerical simulation. The results have shown that with the artery micro heat pipe array, the effective thermal conductivity of the silicon wafer was improved by 330 %.
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