Abstract
A review and perspective is presented of the classical, semi-classical and fully quantum routes to the simulation of electro-thermal phenomena in ultra-scaled silicon nanowire field-effect transistors. It is shown that the physics of ultra-scaled devices requires at least a coupled electron quantum transport semi-classical heat equation model outlined here. The importance of the local density of states (LDOS) is discussed from classical to fully quantum versions. It is shown that the minimal quantum approach requires self-consistency with the Poisson equation and that the electronic LDOS must be determined within at least the self-consistent Born approximation. To bring in this description and to provide the energy resolved local carrier distributions it is necessary to adopt the non-equilibrium Green function (NEGF) formalism, briefly surveyed here. The NEGF approach describes quantum coherent and dissipative transport, Pauli exclusion and non-equilibrium conditions inside the device. There are two extremes of NEGF used in the community. The most fundamental is based on coupled equations for the Green functions electrons and phonons that are computed at the atomically resolved level within the nanowire channel and into the surrounding device structure using a tight binding Hamiltonian. It has the advantage of treating both the non-equilibrium heat flow within the electron and phonon systems even when the phonon energy distributions are not described by a temperature model. The disadvantage is the grand challenge level of computational complexity. The second approach, that we focus on here, is more useful for fast multiple simulations of devices important for TCAD (Technology Computer Aided Design). It retains the fundamental quantum transport model for the electrons but subsumes the description of the energy distribution of the local phonon sub-system statistics into a semi-classical Fourier heat equation that is sourced by the local heat dissipation from the electron system. It is shown that this self-consistent approach retains the salient features of the full-scale approach. For focus, we outline our electro-thermal simulations for a typical narrow Si nanowire gate all-around field-effect transistor. The self-consistent Born approximation is used to describe electron-phonon scattering as the source of heat dissipation to the lattice. We calculated the effect of the device self-heating on the current voltage characteristics. Our fast and simpler methodology closely reproduces the results of a more fundamental compute-intensive calculations in which the phonon system is treated on the same footing as the electron system. We computed the local power dissipation and “local lattice temperature” profiles. We compared the self-heating using hot electron heating and the Joule heating, i.e., assuming the electron system was in local equilibrium with the potential. Our simulations show that at low bias the source region of the device has a tendency to cool down for the case of the hot electron heating but not for the case of Joule heating. Our methodology opens the possibility of studying thermoelectricity at nano-scales in an accurate and computationally efficient way. At nano-scales, coherence and hot electrons play a major role. It was found that the overall behaviour of the electron system is dominated by the local density of states and the scattering rate. Electrons leaving the simulated drain region were found to be far from equilibrium.
Highlights
Silicon metal-oxide semiconductor-field effect transistors (MOSFETs) have underpinned the last fifty years of the microelectronics revolution
We have compared the drain current vs gate voltage characteristic for the case of standard scattering, i.e., assuming the phonon system or the lattice is at equilibrium at 300 K with cases in which the lattice is at higher temperature
Two cases have been considered: case (i): in which the electrons are in local equilibrium with the electrostatic potential, so the energy transfer from the electron system to the phonon system is given by the standard Joule law or the second term in Equation (63); and case (ii), in which the electrons relax to equilibrium depending on the energy relaxation length [92] and the energy transfer are given by the LHS of Equation (63)
Summary
Silicon metal-oxide semiconductor-field effect transistors (MOSFETs) have underpinned the last fifty years of the microelectronics revolution. The scalability of the basic planar single gate MOSFET has already approached the long-anticipated physical limits to device performance that require considerable architectural ingenuity to overcome. These limits include short-channel effects (SCE) such as: quantum mechanical tunnelling between source and drain and between drain and substrate; drain-induced barrier lowering (DIBL); threshold voltage roll-off. Silicon NWFETs have been fabricated with circular cross sections with diameters in a range of 9 to 1 nm [7]. These devices show very good performances and ideal sub-threshold slopes (60 mv/dec). It was suggested that increases in scattering rates or the enhancement of other scattering mechanism such as surface scattering or stresses in the fabrication might be responsible
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.