Providing new formulation for white compound chocolate based on mixture of soy flour, sesame paste, and emulsifier: An optimization study using response surface methodology.

Abstract

This study was aimed at evaluating the suitability of sesame paste as an ingredient in white compound chocolate using response surface methodology. A D‐optimal combined mixture‐process design with three mixture components, sesame paste (15%–30% w/w), soy flour (0%–15% w/w), and milk powder (0%–15% w/w) under variable amount of emulsifier was used to optimize textural (hardness, cohesiveness, and adhesive force) and thermal (T onset and T m) properties of white compound chocolate containing sesame paste. The results showed that the linear effect of all the mixture components was significant (p < .05) on the responses. Applying a desirability function method, the optimum proportion of mixture components, and emulsifier level were as follows: sesame paste 15.5% w/w, milk powder 7.5% w/w, soy four 7% w/w, and emulsifier 0% w/w, respectively. At optimum point, hardness, cohesiveness, adhesive force, T onset, and T m were 367.07 (N), 0.63, 8.46 (N), 28.1 (°C), and 33.7 (°C), respectively. The predicted values were confirmed through validation experiment.