Abstract
The aim of this paper is to report on the use of Microcontact Printing (μCP) for the manufacturing of 3D Molded Interconnects Devices. Two different approaches are reported. A first one is based on the total metallization of the polymer, μCP of the 3D pattern followed by the wet etching of the non-protected areas of the part (the so-called indirect process). A second approach is based on the combination of radio-frequency (RF) plasma treatment, μCP of a pattern of catalysts on the polymer and metallization by electroless deposition (the so-called direct process). This second process allows metallization of bare polymer parts (free of catalytic species in the bulk) with conductive 3D networks ready for the assembly of SMD devices. Examples of MID devices made with both approaches are reported. Key points like thickness (up to 12-15 μm), conductivity and adhesion of the metallic network are also reviewed. Printing on slope surfaces is demonstrated. Advantages and drawbacks of both processes are discussed.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
