Abstract
AbstractThis paper describes the production of atomic clusters and their subsequent assembly into conducting films and wires on insulating substrates. An Ultra‐High‐Vacuum compatible Inert Gas Aggregation cluster deposition system which allows in‐situ electrical measurements to be performed on deposited cluster films has been developed. Accurate placement and dimensional control of cluster‐assembled films has been achieved in this system using soft‐landed Bi and Sb clusters and templated substrates prepared using standard optical and electron‐beam lithography. Self‐contacting cluster‐assembled films produced on planar Six Ny and SiO2 passivated Si substrates have provided a means to study conduction through percolating networks. Cluster‐assembled wires with sub‐100 nm widths have been positioned on templated Six Ny and SiO2 passivated Si substrates. The reported assembly techniques rely upon controlling cluster reflection from substrates and factors which affect the probability of cluster‐reflection are discussed. (© 2006 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)
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