Proceedings of the 4th international conference on Hardware/software codesign and system synthesis
On behalf of Codes+ISSS 20065 Organizing and Program Committees, we would like to welcome you to the 4th IEEE/ACM International Conference on Hardware/Software Co-Design and System Synthesis.Codes+ISSS is the premier event in design of embedded systems hardware, software, and tools. This year we continued building upon the reputation of a high-quality conference by enforcing a rigorous reviewing process, selecting the best submitted papers, and assembling a very exciting program of keynotes, tutorials, special sessions, panels, and regular papers.We received 183 full paper submissions and selected 46 papers for publication, an acceptance rate of 25%. The Program Committee carefully reviewed all papers, with an average of over 5 reviews per paper. The Committee then met face to face for detailed discussions on the papers. Selections were not based on quotas for each topic area, but instead, papers from one topic area were compared to other topic areas in order to select the absolute best set of papers overall. We hope you will find this year's papers to represent some of the most important advances in theory and practice of system-level design and related areas.Codes+ISSS program is uniquely complemented by tutorials and workshops. This year's tutorials cover state-of-the-art topics such as UML for SoC Design and Automotive Electronics, and like last year, tutorials are free to all registered attendees. CODES+ISSS hosts two full-fledged workshops, namely ESTIMedia and a UML hands-on workshop. ESTIMedia has been very successful in previous years and its special emphasis on multimedia-related topics effectively complements the main Codes+ISSS program. The hands-on workshop on UML is a first of its kind in Codes+ISSS and gives attendees the opportunity to learn UML in practice.After a successful debut last year, Embedded Systems Week (ES Week) takes place again, this time expanded with the addition of CASES (a leading conference on architecture and compilers). Codes+ISSS, EMSOFT and CASES are collocated with all sessions in parallel, and registrants to one conference can attend sessions in all three conferences. Moreover, the technical programs of the three conferences, including keynotes, special sessions, panels, tutorials and workshops, have been carefully planned to avoid major overlaps and complement each other. ES Week is uniquely positioned to offer the best technical content for attendees in the areas of embedded systems design, tools, software, architecture and compilers.Codes+ISSS owes its high technical quality to the dedicated members of the Steering Committee, Organizing Committee, Technical Committee and numerous reviewers who contributed their time and expertise to ensure the quality of the conference. We thank them all full heartedly. We would also like to thank our sponsoring societies, IEEE Circuits and Systems Society (CAS) and Computer Society (CS) and the Council of Electronic Design Automation (CEDA), the ACM SigDA, SigBED and SigMICRO. Moreover, we would like to thank our several industrial contributors, without which the conference would not be possible. The excellent level of industrial support demonstrates that Codes+ISSS is able to bridge both academia and industry interests. Finally, thanks are due to all the people who submitted their work to the conference and to the attendees whose active participation is relied upon for lively and interesting technical exchanges.
- Conference Instance
14
- 10.1145/2039370
- Oct 9, 2011
On behalf of the Program Committee, we would like to welcome you to the 9th IEEE/ACM International Conference on Hardware/Software-Codesign and System Synthesis. CODES-ISSS is the premier conference for system-level synthesis and design of embedded systems. We have arranged a rigorous review process in order to select 33 papers among 117 submissions (yielding an acceptance rate of 28%). Each paper had 5.1 reviews, on average. Papers were grouped by topic into similar-sized clusters, with each receiving the attention of a subcommittee composed of approximately 11 committee members. The Program Committee then met in person to debate the merits of the submitted papers. Program Committee members were asked to select the most novel and highest quality work. The Program Committee chairs refrained from submitting papers and Program Committee members were excluded from discussing papers for which they had conflicts of interest. Interaction between presenters and other conference attendees is extremely important in this conference. To encourage this we have organized poster sessions during the last 30 minutes of every session. This will give the audience opportunities to discuss work in detail with those presenting it. In addition to 11 regular sessions, we have also organized five special sessions, one of which was planned in collaboration with the CASES Program Committee. These special sessions cover a wide range of topics including memory technologies, multiprocessor systems-on-chip, microfluidic biochips, and dependable embedded systems. CODES-ISSS is part of the growing Embedded Systems Week event, which brings together numerous embedded systems conferences and workshops. CODES-ISSS is complemented by two other flagship sister conferences: CASES and EMSOFT. Registrants to Embedded Systems Week may attend sessions in any of the three conferences. The technical programs of the three conferences, including keynotes, special sessions, panels, tutorials and workshops, have been planned to complement each other by avoiding major overlaps. The technical quality of the CODES-ISSS program is a direct result of the dedicated efforts of the authors who submitted their work to the conference, Steering Committee, Organizing Committee, Program Committee, and numerous reviewers who contributed their time and expertise. We are grateful to everybody who helped to make CODES-ISSS a success. We would also like to thank our sponsoring societies: ACM SIGBED, SIGDA, SIGMICRO, IEEE Circuits and Systems Society (CAS), IEEE Computer Society (CS), and IEEE Council of Electronic Design Automation (CEDA). This year, the CODES-ISSS is held in Taipei. We hope the conference and its proceedings prove useful to you, and that you enjoy attending.
- Conference Instance
13
- 10.1145/1629435
- Oct 11, 2009
On behalf of the CODES+ISSS 2009 Program Committee, we would like to welcome you to the 7th IEEE/ACM International Conference on Hardware/Software-Co-Design and System Synthesis. CODES+ISSS is the premier conference for system-level design, with a focus on the design of embedded systems hardware, software, and tools. This year we continue the tradition of maintaining a high-quality forum for active discussion on current and innovative topics on embedded systems that bring together the latest in academic and industrial research and development. We selected the best submitted papers through a rigorous review process, and have assembled an exciting program with a mix of keynotes, tutorials, special sessions, panels, and regular papers. This year we received a new record of 157 full paper submissions and selected 51 papers for publication, with an acceptance rate of 32%. The Program Committee carefully reviewed all papers, with an average of 4 reviews per paper. The Committee then met face to face for detailed discussions on the papers. Final paper selections were based on overall quality and novelty. Active interaction between presenters and audience has been traditionally extremely important in this conference. To encourage this we have organized poster sessions for all papers right after their 30 minute oral presentations. This will give you the opportunity to discuss with all presenters independently of which of the two parallel tracks you attended. We trust you will find this year's program to be exciting and stimulating. It truly contains important advances in theory and practice of system-level design and related areas. We also continue the tradition of complementing the CODES+ISSS program with tutorials and workshops. This year's tutorials cover timely and emerging topics such as Smart Cameras and Visual Sensor Networks, Future Embedded Systems, Multimedia Power Management. Several workshops on Thursday and Friday promise a full week of hot topics. Please also note that on Wednesday for the first time we have a full industry track ("industrial day") with a final panel discussion at the end of the day. CODES+ISSS is part of the growing Embedded Systems Week (ESWEEK) event that is becoming the premier international event in embedded systems research and development. CODES+ISSS is complemented by two other flagship sister conferences: EMSOFT (focused on embedded software), and CASES (focused on architecture and compilers). Registrants to ESWEEK are affiliated with a primary conference, but may attend sessions in any of the three conferences. Moreover, the technical programs of the three conferences, including keynotes, special sessions, panels, tutorials and workshops, have been carefully planned to avoid major overlaps and complement each other. The high technical quality of the CODES+ISSS program is a direct result of the dedicated efforts of the Steering Committee, Organizing Committee, Technical Program Committee and numerous reviewers who contributed their time and expertise, as well as the authors who submitted their work to the conference. We are grateful to all of them for their efforts and thank them whole heartedly. We would also like to thank our sponsoring societies: ACM SIGBED, SIGDA, SIGMICRO, and IEEE Circuits and Systems Society (CAS), Computer Society (CS) and the Council of Electronic Design Automation (CEDA). This year the conference takes place in Grenoble, France. We hope you enjoy the conference and the location and we look forward to your participation in CODES+ISSS 2009!
- Conference Instance
20
- 10.5220/0000122800002332
- Jul 29, 2019
This book contains the proceedings of the 4th International Conference on Simulation and Modeling Methodologies, Technologies and Applications (SIMULTECH 2014), which is sponsored by the Institute for Systems and Technologies of Information, Control and Communication (INSTICC) and co-organized by Austrian Computer Society and Vienna University of Technology â TU Wien (TUW). SIMULTECH 2014 is held in cooperation with the ACM SIGSIM - Special Interest Group (SIG) on SImulation and Modeling (SIM), ACM SIGMIS - ACM Special Interest Group on Management Information Systems, Movimento Italiano Modellazione e Simulazione (MIMOS), Japan Society for Simulation Technology, Federation of Asia Simulation Societies and AIS Special Interest Group on Modeling and Simulation (AIS SIGMAS) and technically co-sponsored by the Society for Modeling & Simulation International (SCS), Liophant Simulation, Simulation Team and IEEE Computer Society's Technical Committee on Simulation (TCSIM). This conference brings together researchers, engineers and practitioners interested in methodologies and applications of modeling and simulation. The main topics covered in the papers accepted in the conference are: Methodologies and Technologies, and Applications and Tools of modelling and simulation. We believe the accepted papers demonstrate new and innovative solutions. They also highlight technical issues and challenges in this field. The high quality of the SIMULTECH 2014 program is enhanced by the three keynote lectures, delivered by distinguished speakers who are renowned experts in their fields: Bernard P. Zeigler (University of Arizona, United States), Paul Fishwick (University of Texas at Dallas, United States) and Helena Szczerbicka (Universitat Hannover, Germany). The technical program features three special sessions: Special Session on Computationally Efficient Simulation-Driven Engineering Design Optimization and Modeling (SDDOM), Special Session on Applications of Modeling and Simulation to Climatic Change and Environmental Sciences (MSCCEC) and Special Session on Health Applications (HA). SIMULTECH 2014 received 167 paper submissions, including special sessions, from 45 countries in all continents, of which 23% were presented as full papers. A double blind paper review was performed by the International Program Committee members, all of them recognized in at least one of the main conference topic areas. Conferences are also meeting places where collaboration projects can emerge from social contacts amongst the participants. Therefore, in order to promote the development of research and professional networks the Conference includes in its social program a Conference Social Event & Banquet in the evening of Friday, August 29, 2014. Building an interesting and successful program for the conference required the dedicated effort of many people; we thank them all. Firstly, we must thank the authors, whose research and development efforts are recorded here. Secondly, we thank the members of the program committee and additional reviewers for their diligence and expert reviewing. We also wish to include here a word of appreciation for the excellent organization and support provided by the INSTICC team. Last but not least, we thank the invited distinguished keynote speakers for their invaluable contribution and for taking the time to synthesize and deliver their talks. We hope that you will enjoy the SIMULTECH 2014 program and your stay in the beautiful city of Vienna. We also hope to see you again next year at SIMULTECH 2015 in Colmar, France.
- Research Article
- 10.1109/mcas.2024.3384522
- Jan 1, 2024
- IEEE Circuits and Systems Magazine
IEEE Circuits and Systems (CAS) Society (CASS) celebrates the 75th Anniversary of the Society in 2024. This is a major celebration for CASS after the Golden Jubilee celebration in 1999. This special Issue of the IEEE Circuits and Systems Magazine is one of many celebrations and events planned this year by and for CASS members. The Celebrations not only reflect upon the history of our Society from multiple angles but also look forward to the future. The planning for this Special Issue started in July 2023 when Gabriele Manganaro, VP-Publications of IEEE CASS, tasked the incoming Editor-in-Chief (KP) to plan for the Special Issue. A Call for White Papers was issued to the CASS membership on 20 July 2023. The authors were asked to provide historical progress over the last 25 years and point out future directions for the next 25 years. We received numerous White Papers in September 2023, and were able to invite only few authors to submit Full Papers. Authors of Invited White Papers submitted their Full papers in second half of December 2023. All reviews were completed by March 2024. Before providing an overview of the papers in this Special Issue, we begin by thanking all the authors who took the time to submit the White Papers (whether Invited or not) and the Full papers. We are very grateful to all the reviewers who provided reviews in short notice due to the time constraints to publish the Special Issue.
- Research Article
- 10.1088/1755-1315/1303/1/011001
- Feb 1, 2024
- IOP Conference Series: Earth and Environmental Science
It is with great pleasure and enthusiasm that the Faculty of Civil Engineering & Technology, Universiti Malaysia Perlis (UniMAP) present the proceedings of The 6th International Conference on Civil and Environmental Engineering (CENVIRON) 2023, hosted in conjunction with The Global Trends in Engineering, Science & Technology Congress 2023 (GTEST2023). This edition’s theme, “Enhancing Liveability and Sustainability through Green Technology,” highlights our dedication to investigating cutting-edge solutions that promote a more liveable and sustainable society. The hybrid conference, held on September 4 – 5th, 2023, at the Sabah Room, World Trade Centre (WTC), Kuala Lumpur, Malaysia, gathered academicians, researchers, and practitioners from around the world together. We honourably welcome our keynote and invited speakers Associate Professor Dr. Filippo Giustozzi, RMIT University, Australia and Professor Dr. Sumate Chaiprapat, Prince of Songkla University, Thailand.CENVIRON’s principal goal is to provide an effective forum for the sharing of knowledge, research findings, and technology breakthrough. This conference is critical in encouraging collaboration and creativity within the community as we traverse the ever-changing landscape of sustainability in civil and environmental engineering subjects aligned to SDG 6, 11, 12 and 17. The primary subjects addressed in this conference include, the:1. Environmental Sustainability and Green Practices,2. Water Management and Quality,3. Environmental Health and Safety,4. Urban Ecology, Transportation, and Pollution ControlWe would like to express our heartfelt appreciation to the individuals and organisations who made this event possible. Prof. Dato’ Ts. Dr. Zaliman Sauli, Vice Chancellor of Universiti Malaysia Perlis (UniMAP), and Assoc. Prof. Ts. Dr. Zulzikrami Azner Abidin, Dean of the Faculty of Civil Engineering & Technology, and the Research Management Centre UniMAP’s team deserve our warmest gratitude for their outstanding support and coordination. We also thank our valued co-organizers from Universiti Teknologi Brunei, Universitas Muhammadiyah Aceh, and Universiti Teknologi Malaysia for their combined efforts.Without the kind sponsorship of Construction Industry Development Board (CIDB), Master Jaya Green Technology, Mega Jati Academy Sdn. Bhd. and Pentas Flora Sdn. Bhd., this conference would not have been possible. Their financial assistance has significantly facilitated the expansion of CENVIRON, enabling us to provide a prestigious and comfortable venue for vital discussions and the exchange of knowledge.The conference’s geographical scope was not restricted to the physical venue alone. On September 5, 2023, we expanded our reach to the Tuanku Syed Faizuddin Putra Library, Universiti Malaysia Perlis Main Campus, Perlis, Malaysia, in addition to the World Trade Centre in Kuala Lumpur, Malaysia. This dual-location strategy sought to increase participant accessibility and participation. The conference used a hybrid strategy that included both physical and online sessions. The 11 attendees in person had a rich programme with two parallel sessions, while the 53 participants who joined remotely via the Google Meet platform had nine parallel sessions. Each presentation, including the Q&A, was allotted 20 minutes, guaranteeing a lively and participatory atmosphere.Participants, both actual and virtual, contributed enthusiastically to the various sessions hosted on the Google Meet platform. The chairpersons’ and co-hosts’ joint efforts over nine various links facilitated smooth sessions and vibrant debates. We urge you to explore the wealth of knowledge offered in these proceedings, which demonstrates the community’s dedication to furthering Earth and Environmental Science. We hope that the ideas offered during the 6th CENVIRON will spark additional study, collaboration, and technical breakthroughs for the benefit of our global community.List of Executive Committee, Organizing and Technical Committee are available in the pdf.
- Research Article
- 10.1109/mcas.2024.3427029
- Jan 1, 2024
- IEEE Circuits and Systems Magazine
The IEEE Circuits and Systems Society (CASS) celebrated its 75th anniversary at the IEEE International Symposium on Circuits and Systems (ISCAS). A significant event was the “Past President Sharing Panel,” featuring insights from IEEE CASS Past Presidents Sung-Mo (Steve) Kang, Ljiljana Trajkovic, Maciej Ogorzalek, Franco Maloberti, and Amara Amara. Their presentations and panel discussions provided a comprehensive overview of the Society’s history and future direction, emphasizing diversity, innovation, and global collaboration to shape the future of circuits and systems.
- Conference Instance
4
- 10.1145/1254766
- Jun 13, 2007
It is with great pleasure that we welcome you to the ACM 2007 Conference on Languages Compilers and Tools for Embedded Systems (LCTES'07) on behalf of its organizational committees. The aim of LCTES is to provide a premier forum for sharing the latest significant research results on embedded systems, with an emphasis on programming languages, compilers, tools, and novel architectures. We hope that you will find this year's program interesting and thought-provoking and that the conference will once again provide you with a good opportunity to interact with researchers and practitioners from around the world. In response to our call for papers, 76 papers were submitted from academic and industrial institutions in Africa, Asia, Australia, Europe, Middle East, and North and South Americas. All submissions were reviewed through a "double-blind" process, in which the authors remained anonymous (except to the Program Chair) until the acceptance decisions were made by the program committee. Papers submitted by members of the program committee were subjected to the same review process. Neither the program Chair nor the general Chair submitted any papers. Each submitted paper was reviewed by at least three committee members, with the help from external expert reviewers in some cases. Over 93% of the submitted papers were each reviewed by four to six committee members. The program committee convened on the 25th of March in Chicago for an all-day meeting to reach consensus on the program. Members with a potential conflict of interest on a paper neither reviewed nor participated in the discussion of the paper. Anyone from the same institution of a coauthor or, in the past three years, having published a paper with him or her is considered as having a conflict of interest on that submission. The program chair had a conflict of interest on one of the submissions. The review and discussion of that paper was moderated by Professor Jack Davidson of University of Virginia without any involvement of the Program Chair. At the end of the meeting, the program committee selected 21 high quality papers for the regular program, representing roughly a 28% acceptance rate. The committee also identified nine additional papers and invited their authors to the poster session. We are pleased that the poster authors have an opportunity to present a work-in-progress summary in a special session. The composition of the program before you covers a range of important issues in embedded systems, including software reliability, low-power computing, embedded Java, real-time systems, multi-core systems, VLIW for DSP/stream applications, compiler analysis, and the entire memory hierarchy. We thank the program committee and the external reviewers for their diligent review effort and to all the authors who submitted their most recent fine work to this conference.
- Front Matter
- 10.1088/1742-6596/1477/1/011001
- Mar 1, 2020
- Journal of Physics: Conference Series
The 2nd International Conference on Computer, Science, Engineering, and Technology (ICComSET-2019), provides an excellent international forum for sharing knowledge and results in theory, methodology and applications of Computer, Science, Engineering and Technology in theoretical and practical aspects. The conference aims to provide a platform to the researchers and practitioners from both academia as well as industry to meet and share cutting-edge development. The 2nd ICComSET-2019 is organized by Universitas Muhammadiyah Tasikmalaya and Universitas Muhammadiyah Tangerang. The 2nd ICComSET-2019 secretariat has received more than 300 submissions from 6 countries: Malaysia, Algeria, Iraq, Ukraine, India, and Indonesia. The program held in Allium Hotel Tangerang, and supported by several universities as Co-Host, including Universitas Muhammadiyah Tapanuli Selatan, Universitas Jenderal Achmad Yani, Universitas Muhammadiyah Kudus, STIKES Muhammadiyah Klaten, Universitas Muhammadiyah Sukabumi, STKIP Muhammadiyah Sampit, Universitas Langlangbuana, and Universitas Widyatama.Each paper has been reviewed by the program committee which consisted of more than 300 scientists from more than 6 countries. The conference program consists of 2 keynote speakers (60 min), 5 Invited speakers (150 min), 5 parallel sessions, one poster session, and six round tables.We would like to thank the scientific committee, and reviewers, as well as the committee of the Universitas Muhammadiyah Tasikmalaya, Universitas Muhammadiyah Tangerang, and Co-Host who have participated in the success of this event so that this event can be held as planned. We also conveyed to the Rector of Universitas Muhammadiyah Tasikmalaya who had supported this event both in terms of finance and other supporting facilities.List of General Chair, The Editors, CONFERENCE PHOTOGRAPH, Program Committee, Organizing Committee are available in this pdf.
- Conference Instance
12
- 10.1145/1289816
- Sep 30, 2007
On behalf of the CODES+ISSS 2007 Organizing and Program Committees, we would like to welcome you to the 5th IEEE/ACM International Conference on Hardware/Software Co-Design and System Synthesis. CODES+ISSS is the premier conference for system-level design, with a focus on the design of embedded systems hardware, software, and tools. This year we continue the tradition of maintaining a high-quality forum for active discussion on current and innovative topics on embedded systems that bring together the latest in academic and industrial research and development. We selected the best of submitted papers through a rigorous review process, and have assembled an exciting program with a mix of keynotes, tutorials, special sessions, panels, and regular papers. This year we received 127 full paper submissions and selected 40 papers for publication, with an acceptance rate of 31%. The Program Committee carefully reviewed all papers, with an average of over 5 reviews per paper. The Committee then met face to face for detailed discussions on the papers. Final paper selections were based on overall quality and novelty; papers with the highest quality and novelty were compared across different topic areas to yield the absolute best set of papers overall. We trust you will find this year's program to be exciting and stimulating, representing important advances in theory and practice of system-level design and related areas. We also continue the tradition of complementing the CODES+ISSS program with tutorials and workshops. This year's tutorials cover timely and emerging topics such as "Programming the PLAYSTATION3 Cell Architecture" and "Compiling Code Accelerators for FPGAs", and are free to all registered attendees. CODES+ISSS 2007 hosts two full-fledged workshops: ESTIMedia, with a special emphasis on multimedia-related topics; and WASP, with a focus on application-specific processors. CODES+ISSS is part of the growing Embedded Systems Week (ESWEEK) event that is becoming the premier international event in embedded systems research and development. CODES+ISSS is complemented by two other flagship sister conferences: EMSOFT (focused on embedded software), and CASES (focused on architecture and compilers). Registrants to ESWEEK are affiliated with a primary conference, but may attend sessions in any of the three conferences. Moreover, the technical programs of the three conferences, including keynotes, special sessions, panels, tutorials and workshops, have been carefully planned to avoid major overlaps and complement each other. ESWEEK blazes the embedded systems trail and is uniquely positioned to offer the best technical content for attendees in the areas of embedded systems design, tools, software, architecture and compilers.
- Research Article
1
- 10.1111/maps.13419
- Nov 28, 2019
- Meteoritics & Planetary Science
Conference report: Large Meteorite Impacts and Planetary Evolution VI
- Conference Instance
25
- 10.1145/2384616
- Oct 19, 2012
Welcome to the 2012 ACM SIGPLAN Conference on Object-Oriented Programming, Systems, Languages, and Applications (OOPSLA). We believe that we have selected an interesting and high-quality program of research papers. As you will see, OOPSLA continues to expand beyond the conference's 1986 roots in object-oriented programming. This year's papers discuss many topics, including: concurrency, verification, program analysis, types, fault detection, program understanding, dynamic languages, compilation, and a variety of approaches that support the program development process. As you can see from this topic list, this instance of OOPSLA continues to explore core issues in programming languages and reaches out to connect with broader issues in software engineering. Papers were reviewed by a combination of the OOPSLA program committee (PC), consisting of 31 experts in the field, and the OOPSLA external review committee (ERC), also consisting of 31 experts. Each paper was assigned to at least three committee members to review; submissions from PC members were treated specially as discussed below. The reviews were made available to authors who were then able to write a response providing clarification to reviewers. Author responses were read and, in some cases, used to identify papers for which an additional fourth review was needed. The program committee meeting, which was held on June 29--30, 2012 at the Harris Center of the University of Central Florida, in Orlando, was attended by all of the OOPSLA PC members. I would like to thank Gary Leavens and Rochelle Elva for all of their assistance with the organization and operation of the program committee meeting. OOPSLA is a healthy research conference. This year a record number of papers, 228, were submitted and 59 were accepted. This 25.8% acceptance rate is slightly higher than the historical average of 24.4%. The OOPSLA conference allows committee members to submit papers. Papers co-authored by program committee members were reviewed by the ERC. Discussion of those submissions and acceptance decisions were made separately from the program committee meeting. The papers were all evaluated individually and held to a slightly higher standard than non-PC submissions. This year, 21 papers were submitted with program committee co-authors, and 5 were accepted. It is an honor and a privilege to serve as research program chair for OOPSLA 2012. It is also a pleasure to work with the many dedicated professionals who comprised the PC and ERC for OOPSLA. I thank them for all of the time and effort they contributed to help build a strong program. As those who have served on PCs know, the amount of work that goes into reviewing papers is significant and it is often quite impressive to see the quality and depth of feedback that fellow reviewers provide to authors. This year I decided to consult with the PC to identify a member of the PC who did a particularly noteworthy job in reviewing papers, responding to author feedback and the feedback of other reviewers, and advocating for papers during the PC meeting. Seven individuals were nominated, which indicates the breadth of quality in the conduct of the PC this year. Isil Dillig received the most nominations and she has the honor of being named 2012 OOPSLA Distinguished Reviewer. I hope that you find the papers that we have accepted for inclusion in OOPSLA 2012 to be both of current interest and of long-term significance to the OOPSLA community.
- Research Article
- 10.1088/1755-1315/1216/1/011001
- Jul 1, 2023
- IOP Conference Series: Earth and Environmental Science
Preface The 4th International Conference on Green Environmental Engineering and Technology (IConGEET 2022) was a hybrid conference and physically took place in Seoul, Korea on 17-18th November 2022. IConGEET2022 was jointly organised with the 4th International Conference on Green Engineering and Technology (IConGeTech2022). The conference was organized by the Sustainable Environmental Research Group (SERG), Centre of Excellence Geopolymer and Green Technology (CEGeoGTech), Universiti Malaysia Perlis. The conference received international and local collaboration, support and participation from the National Institute for Research and Development in Environmental Protection (INCDPM) Romania, Ton Duc Thang University, Ho Chi Minh City, Viet Nam as well as local universities in Malaysia.It brought together researchers, practitioners, engineers and students worldwide in hope to extend networking, integrate knowledge and exchange ideas among participants. This year, the theme “Driven Technologies toward Sustainable Environment” is driving exciting breakthroughs to help sustaining our planet. Overcoming the engineering challenges of high performance, interoperability and security is critical to delivering next-generation solutions for decreasing emissions, minimizing waste and preventing pollution. Over 70 distinguish researchers, practitioners, engineers and students from across the country have presented their current and intriguing research in the scope of civil and environmental technologies and management, which evolved around five major areas: water and wastewater technology, green technology, air pollution and climate change, environmental management and protection as well as environmental sustainability and development.The conference has gained incredible success due to collective efforts from the organizing committees, the co-organizers, the reviewers, presenters, and all participants. We would like to thank all the reviewers involved in ensuring each contributed paper were refereed and accepted based on interests, relevance, innovation and pure contribution towards environmental engineering and technology fields. Putting together, the success of the conference is a team effort. I am grateful to all the committee members who worked very hard to make this event a successful one. Finally special thanks go to the Universiti Malaysia Perlis for the continuous support throughout the conference event.List of Editors, Organisers, Committee, Organizing & Technical Committee are available in the pdf.
- Front Matter
- 10.1088/1742-6596/1611/1/011001
- Aug 1, 2020
- Journal of Physics: Conference Series
XVII International Conference of Students and Young Scientists “Prospects of Fundamental Sciences Development” (PFSD-2020) conf-prfn.org 21-24 April, 2020 Tomsk, Russia The XVII International Conference of Students and Young Scientists “Prospects of Fundamental Sciences Development” (PFSD-2020), held on 21-24 April, 2020 in Tomsk, Russia, is an annual multidisciplinary conference gathering together students, young researchers, post-docs, and experienced researchers working in the different research areas in order to facilitate aggregation and sharing interests and results for a better collaboration.This year the conference took place virtually because of the restriction of travelling inside the country and accepting participants from abroad due to the COVID-19 pandemic. The Organizing Committee was mainly located in Tomsk; some members of Organizing and Program Committee were in other cities. The technicians respecting all safety requirements were working at universities to ensure uninterrupted technical support to the Conference.The Model of the conference practically did not change: invited experts and keynote speakers made plenary reports (40-60 minutes), session reports were about 10 minutes, the time for questions and answers was not practically limited. It is worth noting that the virtual conference allowed expanding significantly the geography and the number of participants. The whole research groups took an active part in the work of the sessions and there were no limits for attendees who would like to listen to the speech of their colleagues. The colleagues from other universities, professors and their students were actively involved in discussions. All conference participants had the opportunity to pose and answer questions.
- Research Article
- 10.1109/tcsii.2019.2909179
- May 1, 2019
- IEEE Transactions on Circuits and Systems II: Express Briefs
This special issue of the IEEE Transactions on Circuits and Systems—Part II: Express Briefs ( TCAS-II ) follows the successful co-publication initiative started last year by the IEEE Circuits and Systems Society (CASS) to publish a selection of the best papers accepted for presentation at the IEEE International Symposium on Circuits and Systems (ISCAS), held this year in Sapporo, Japan, on May 26–29. As TCAS-II only publishes five-page briefs, and hence both conference and journal versions of selected works would be largely overlapped, the papers included in this issue represent the only record published in IEEE Xplore and they will not appear in the Proceedings of IEEE ISCAS , which will however contain DOI links to the corresponding TCAS-II papers. Similar to other IEEE societies, IEEE-CASS intends to shift the role of IEEE conferences toward networking events as well as a scientific discussion opportunity, rather than putting the emphasis on the conference paper publication itself.
- Research Article
- 10.1109/tcsii.2022.3164803
- May 1, 2022
- IEEE Transactions on Circuits and Systems II: Express Briefs
This special issue of the IEEE Transactions on Circuits and Systems—Part II: Express Briefs (TCAS-II) continues the successful tradition of the co-publication initiative started few years ago by the IEEE Circuits and Systems Society (CASS) to publish a selection of the best papers accepted for presentation at the IEEE International Symposium on Circuits and Systems (ISCAS). This year ISCAS is held in Austin, Texas, United States of America, on May <inline-formula> <tex-math notation="LaTeX">$28^{\mathrm{ th}}$ </tex-math></inline-formula> – June <inline-formula> <tex-math notation="LaTeX">$1^{\mathrm{ st}}$ </tex-math></inline-formula>, and the process for this Special Issue was carried out as soon as the paper selection was done. As TCAS-II only publishes 5-page briefs, and hence both conference and journal versions of selected works would be largely overlapped, the papers included in this Issue will not appear in the Proceedings of the IEEE ISCAS. Also, similar to what is done by other IEEE Societies, IEEE CASS intends to shift the role of IEEE conferences towards more networking events as well as opportunities for discussions on ongoing research efforts.