Abstract
Synchrotron x-ray microdiffraction (\(\upmu \hbox {XRD}\)) allows characterization of a crystalline material in small, localized volumes. Phase composition, crystal orientation and strain can all be probed in few-second time scales. Crystalline changes over a large areas can be also probed in a reasonable amount of time with submicron spatial resolution. However, despite all the listed capabilities, \(\upmu \hbox {XRD}\) is mostly used to study pure materials but its application in actual device characterization is rather limited. This article will explore the recent developments of the \(\upmu \hbox {XRD}\) technique illustrated with its advanced applications in microelectronic devices and solar photovoltaic systems. Application of \(\upmu \hbox {XRD}\) in microelectronics will be illustrated by studying stress and microstructure evolution in Cu TSV (through silicon via) during and after annealing. The approach allowing study of the microstructural evolution in the solder joint of crystalline Si solar cells due to thermal cycling will be also demonstrated.
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