Abstract
AbstractThe in-situ lift-out method for TEM sample preparation, based on the use of a chamber-mounted nanomanipulator and FIB induced material deposition, has proven its effectiveness over the last several years. The time-efficiency introduced by this method is one reason for its success and rapid adoption within the semiconductor industry. Improvements to in-situ TEM lift-out preparation have been pursued to further improve sample processing time. One area targeted has involved methods to enable rapid in-situ probe tip replacement without having to remove the probe shaft from the vacuum chamber. This paper describes an in-situ probe tip replacement system that successfully solves this problem.
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