Abstract
AbstractIn this work, a bio‐based benzoxazine monomer (C‐s) is synthesized from cardanol, stearylamine, and paraformaldehyde through solvent‐free method. Pyrogallol is used as a curing catalyst for the ring‐opening polymerization of benzoxazine. Differential scanning calorimeter (DSC) results reveal that doping with pyrogallol reduces the exothermic peak temperature (Tp) of C‐s from 256 to 174 °C. The polybenzoxazine/pyrogallol/polyhedral oligomeric silsesquioxane (PC‐s/py/POSS) nanocomposites are prepared via thermal curing. The doping of aminopropyl isobutyl POSS (POSS‐NH2) can reduce the dielectric constant of polybenzoxazine. The dielectric constant of PC‐s/py/POSS is 2.64 at 1 MHz when the doping amount of POSS‐NH2 is 10 wt%. The results of thermogravimetric analysis (TGA) and water absorption test indicate that the PC‐s/py/POSS nanocomposites possess good thermal stability and water resistance. In summary, the PC‐s/py/POSS nanocomposites with low curing temperature and low dielectric constant are expected to be applied to the low dielectric materials for microelectronic applications.
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