Abstract
This is the conference proceedings of the 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, which is held on July 15th and 16th in the University of Tokyo. Similarly to the preceding 1st (2007), 2nd (2010) and 3rd (2012) workshops, this workshop provides comprehensive information on the latest development and applications, as well as business opportunities, in low-temperature bonding technologies, including surface activated bonding (SAB), new device applications, facilities and technologies for mass-production, and the basic science related to the technologies. The low-temperature bonding is leading to entirely new manufacturing approaches to 3D and heterogeneous integration not only for semiconductor devices and microsystems but also energy systems and power devices.
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