Abstract
This paper presents a prediction model for ground surfaces that uses the actual grinding wheel topography to perform a grinding simulation. Precise knowledge of expected machined surfaces plays an important role in process planning. Here, the main criterion is the achievement of the components’ function after manufacturing. Therefore, it is essential to consider the surface roughness to enable a function-orientated workpiece surface. The presented approach uses a real grinding tool topography, which is measured by a 3D laser triangulation sensor in the machine tool. After a data processing step, the measured topography is imported into a material removal simulation. A kinematic simulation of the realistic ground surface enables the data-based confirmation of the envelope profile theory for the first time.
Highlights
The state of the surface largely affects the properties of a component
A theory based on the envelope profile of a grinding tool was entrenched following the hypothesis that the highest point on the circumference of the grinding wheel generates the envelope profile and the workpiece surface [2]
The laser triangulation method enables the measurement of exactly the same area in each iteration of the wear investigation
Summary
The state of the surface largely affects the properties of a component. It influences haptic, optics and tribological properties as well as the lifetime. A reason for this is that actual tool topography has not yet been considered in simulation models. They present many simulation models, which predict the process forces and temperature, chip thickness and subsurface properties as well as the surface topography. Most of those use simplified or modelled grains on the grinding tool surface.
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