Abstract

Electronics cooling by direct immersion of the components in a dielectric liquid to obtain pool boiling is a valuable solution to dissipate the high heat fluxes of latest and increasingly challenging requirements. In the last decades, perfluorocarbons such as FC-72 were intensively studied and used. However, such fluids will be replaced by other refrigerants with lower Global Warming Potential. The Novec 649 is a suitable alternative to FC-72 as most of the thermophysical properties are similar. Enhanced boiling of FC-72 due to electric fields has been a subject of studies in the past years, for ground and space applications. The aim of this work is to compare the boiling performances of the two fluids in the presence of a DC electric field. Boiling curves were obtained at ambient pressure with fully degassed fluids and at different subcooling levels. Results showed that the performances of the two fluids are comparable in the absence of the electric field, but there are some differences when the electric field is on: electric field enhances the heat transfer coefficient of Novec 649 at low heat fluxes and the Critical Heat Flux at high subcooling. Boiling patterns and bubbles dynamics appear quite different between the two fluids in the presence of the electric field. These observations are explained with the fact that while FC-72 behaves as an electric insulator, while Novec 649 is a leaky-dielectric in the examined conditions. Thus, Novec 649 is a valid replacement of FC-72 and further investigations are needed to better quantify its boiling performances under the action of an electric field.

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