Abstract
Polystyrene (PS)-core silica-shell composite particles with various core sizes were synthesized and applied in chemical mechanical planarization (CMP). The structures of the obtained PS/SiO2 core/shell particles (CSPs) were characterized by field-emission scanning electron microscopy (FESEM), transmission electron microscopy (TEM), and dynamic light scattering (DLS). The effects of the PS core size on oxide CMP behaviors were investigated by atomic force microscopy (AFM) based on the surface profilogram, roughness, and material removal rate (MRR). The roughness of the substrate surface slightly increased with increasing core size, while the MRR obviously increased. The lowest root-mean-square roughness value (0.198 nm) was obtained for the PS/SiO2 CSPs with the smallest cores (216 nm), while the highest MRR (148.9 nm/min) was observed for the CSPs with the largest cores (552 nm). In addition, these polishing results were rationalized according to the indentation-based mechanism, incorporating the total number of active abrasives and the particle indentation depth into the wafer surface.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
