Abstract
This paper describes a novel method for the deposition of gold, silver and palladium colloids on polysilane films by reducing the corresponding metal salt dissolved in alcohol without the use of any other reductants, and an application of the methodology to the pattern formation of copper and nickel metal by palladium-catalyzed electroless metallization on the surface of poly(methylphenylsilane) film, in combination with UV light lithography at 254 nm without the use of any other photoresists.
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