Abstract
In this study, a series of polycarbonates were examined as temporary adhesives for wafer-to-wafer bonding. Temporary adhesives require adequate adhesion strength, solvent resistance, and thermal stability during processing of the mated wafers. Polycarbonates were shown to have thermal and chemical stability over a range of values, as well the ability to thermally release the substrates over a range of temperatures. The polycarbonates had adequate adhesion strength for wafer processes, such as polishing. Little or no mechanical force is required to release the wafers after thermal decomposition of the polycarbonate.
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