Abstract
AbstractIn order to investigate the plastic strain changes of power device packaging in thermal cycling test, a 3D finite element model based on IGBT (Insulate Gate Bipolar Transistor) module was established by using SCDM, then conducted the thermal-structural coupling analysis of IGBT module with ANSYS software, compared the plastic strain distribution at the different thickness of different components by orthogonal analysis method, and compared the plastic strain of IGBT module under solder layer of different materials. The results show that the equivalent plastic strain of the IGBT module decreases with the substrate thickness and the DBC layer thickness. With the increase of substrate solder layer thickness, the equivalent plastic strain has an overall upward trend, decreasing first, then increasing, and then decreasing again, but remaining higher than the initial value. Besides, the thickness of the substrate solder layer has the most critical influence on the plastic strain of the module, while the thickness of the DBC copper layer has the least influence on it. Furthermore, using Nano silver as the solder layer can reduce the plastic strain of the IGBT module, which is 19.14% lower than the initial parameters.KeywordsThermal cyclingSolder layerPlastic strain
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