Abstract

Decapsulation of plastic integrated circuit (IC) packages with copper wire bonding is achieved by using an atmospheric pressure microwave induced plasma. A thermal model is built to estimate the bulk IC package temperature under different plasma etching conditions. Temperature measurements of the plasma effluent and IC package are made to validate the model. Due to the low heat transfer rate from gas to solid, the plasma effluent of 700°C raises the bulk temperature of an IC package to 150°C only. This brings a great advantage in processing because a high temperature on a focused area where the plasma etching takes place results in a high etching rate, while a low IC package bulk temperature ensures minimum thermally induced damage to the internal components. Recipes for three etching steps are developed. An IC package with 38 um copper wire bonds and a 2 mm ∗ 3.5 mm die is decapsulated in 20 minutes. Copper bond wires, aluminum bond pads, and structures on the die are undamaged after decapsulation.

Full Text

Published Version

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.