Abstract
Biomass from annual fibers and agricultural wastes as a raw material to produce particleboard or other composite panels has gained increased popularity. The purpose of this study was to investigate the suitability of corn stalk as a material for particleboard manufacturing. The effect of adhesive type and concentration on the physical and mechanical properties of particleboard manufactured from corn stalk was evaluated. Particleboards were produced using hot-pressing machine at temperature of 130 °C for urea formaldehyde (UF) and 150 °C for phenol formaldehyde (PF) adhesives until 10 min. The size of particleboards and target density were 25 mm x 25 mm x 0.9 mm and 0.8 g/cm3, respectively. The adhesive content was varied from 8, 10 and 12 wt%. The results showed that the physical and mechanical properties of particleboards had better values with increasing the adhesive concentration. The board bonded with PF adhesive showed better physical and mechanical properties than the board bonded with UF adhesive. The modulus of rupture, modulus of elasticity and internal bond of the board bonded with 12 wt% of PF fulfilled the requirement of the JIS A 5908 (2003) for type 13 particleboard.
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