Abstract

So far, copper has been difficult to process via laser powder bed fusion due to low absorption with the frequently used laser systems in the infrared wavelength range. However, green laser systems have emerged recently and offer new opportunities in processing highly reflective materials like pure copper through higher absorptivity. In this study, pure copper powders from two suppliers were tested using the same machine parameter sets to investigate the influence of the powder properties on the material properties such as density, microstructure, and electrical conductivity. Samples of different wall thicknesses were investigated with the eddy-current method to analyze the influence of the sample thickness and surface quality on the measured electrical conductivity. The mechanical properties in three building directions were investigated and the geometrical accuracy of selected geometrical features was analyzed using a benchmark geometry. It could be shown that the generated parts have a relative density of above 99.95% and an electrical conductivity as high as 100% International Annealed Copper Standard (IACS) for both powders could be achieved. Furthermore, the negative influence of a rough surface on the measured eddy-current method was confirmed.

Highlights

  • Publisher’s Note: MDPI stays neutral with regard to jurisdictional claims in published maps and institutional affiliations

  • Additive manufacturing processes offer a high degree of geometrical freedom for the fabrication of complex parts and are a promising technology for pure copper applications

  • Pure copper has been processed via electron beam melting (EBM) [1,2,3,4], binder jetting (BJ) [5], laser powder bed fusion (LPBF) [6,7,8,9,10,11,12,13,14] and laser metal deposition (LMD) [15,16,17]

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Summary

Introduction

Copper has the second highest thermal and electrical conductivity of all nonsuperconducting materials, making it the material of choice for many functional applications such as heat exchangers or induction coils. Additive manufacturing processes offer a high degree of geometrical freedom for the fabrication of complex parts and are a promising technology for pure copper applications. Pure copper has been processed via electron beam melting (EBM) [1,2,3,4], binder jetting (BJ) [5], laser powder bed fusion (LPBF) [6,7,8,9,10,11,12,13,14] and laser metal deposition (LMD) [15,16,17].

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