Photoelasticity-based stress field analysis of glass under 1064 nm laser irradiation

Abstract

Laser-induced thermal cracking in glass cutting surpasses traditional methods. Understanding dynamic thermal stresses is crucial for exploring mechanisms and controlling trajectories. We developed a real-time stress measurement system using the photoelastic method. Scanning soda-lime glass with a 1064 nm laser at various speeds, we analyzed stress changes with a finite element model. Results revealed phase entanglement issues, resolved by phase unwrappling. Stress differences peaked at 105 MPa (2 mm/s) and 78 MPa (4 mm/s). 2 mm/s scanning led to wider, longerwrapp cracks than 4 mm/s due to higher stress levels. Simulation and experimental results agreed, enhancing stress analysis comprehensively.