Abstract
Cu–Ti alloys synthesized in the surface layer of copper by means of preliminary Ti coating deposition and subsequent treatment by compression plasma flows have been investigated in this work. X-ray diffraction, scanning electron microscopy, energy-dispersion X-ray microanalysis, Auger electron spectroscopy, Vickers microhardness measurements and tribological tests were used for Cu–Ti alloys characterization. The findings showed that the increase of the energy absorbed by the surface layer during plasma treatment from 57 to 74 J/cm2 per pulse resulted in the growth of the alloyed surface layer thickness from 15 to 19 μm, more homogeneous distribution of Ti in the alloyed layer and the decrease of Ti average concentration from 13.1 to 9.7 at.% in it. The supersaturated solid solution of titanium in copper was the main phase constituent of the alloyed layer after treatment at 74 J/cm2. The synthesized surface of the Cu–Ti alloy possessed enhanced strength and tribological properties.
Highlights
Copper and copper alloys are widely used in industry mainly due to their high electrical and thermal conductivity [1]
After that pure copper samples were treated by Compression plasma flows (CPF) in the range of density of energy absorbed by the surface layer 20 – 68 J/cm2
CPF impact on the samples of the Ti/Cu system at the energy absorbed by the surface layer in the range of 57-74 J/cm2 resulted in the formation of the copper surface layer alloyed by titanium atoms
Summary
Copper and copper alloys are widely used in industry mainly due to their high electrical and thermal conductivity [1]. The concentration of the coating element in the alloyed layer depends on the coating thickness and CPF treatment regimes (the energy absorbed by the surface layer and the number of pulses). The increase of both energy absorbed by the surface layer and the number of pulses leads to the alloying element concentration decrease.
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