Performance of Online and Offset Micro Pin-Fin Heat Sinks With Variable Fin Density

Abstract

A comparison of the performances of online and offset micro pin-fin heat sinks with variable fin density is given in this paper. The cooling systems generate uniform junction temperatures, which improves the integrated circuit (IC) chip's performance. Water is used as a coolant in the single phase and laminar regime. 4748 micro flat fins with rounded sides, which are distributed in three different sections along the flow length, are used in these configurations. The bottom wall temperature profile along the flow length, overall thermal resistances, pressure drops, and pumping powers for both configurations are presented. The results indicate that the offset micro pin-fin heat sink is a good alternative for cooling the IC chips of 2016. The cooling system using this fin configuration is capable of achieving a thermal resistance as low as 0.1 K/W with a pumping power requirement of 0.45 W. Comparisons with other cooling devices reported in the technical literature are presented.