Abstract
Cryosorption pumps are only possible solution to pump helium gas in Tokamak. In this paper, we report the performance improvement of cryosorption pump, whose pumping speeds are increased by enhancing the thermal conductivity of epoxy by mixing fine aluminium powder as filler into it. From experimental studies it is found that 35% volume fraction of filler in epoxy adhesive is optimum for the improved thermal conductivity without reduction of the bonding strength. The pumping speed of cryosorption pump is increased by 3.60 times for helium gas when compared to identical commercial cryosorption pump.
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