Abstract

In this research, virtual metrology models, which can estimate the quality characteristics based on the given manufacturing parameters, were developed by lasso regression and support vector regression. Then, the virtual metrology (VM) models were integrated into a mathematical model to minimize the adjustment of manufacturing parameters and ensure the corresponding quality characteristics that would meet the customers’ needs. According to the results of the experiment, it was found that developing the virtual metrology model by using integration of lasso regression and support vector regression and taking second order terms into consideration produces the best performance for estimating the quality characteristics. Moreover, the integrated mathematical model can provide manufacturing parameters that minimize the amount of adjustment and ensure that the quality characteristics equal their corresponding target values. The proposed methodology can reduce the setup times and consequently increase productivity.

Highlights

  • Trends in the printed circuit board (PCB) industry are obviously affected by the requirements of the manufacturers of computers, communication equipment, and consumer electronics

  • Based on a piece of semiconductor equipment for the etching process, the results show that the accuracy of NN is better than multi-regression (MR), but the process time will be the issue for real applications

  • According to the test in fifth generation thin film transistor-liquid crystal display (TFT-LCD) chemical–vapor deposition processes, the results show that both one-hidden-layered back-propagation neural network (BPNN) and simple recurrent neural networks (SRNN) virtual metrology (VM) algorithms achieve acceptable conjecture accuracy and meet the real-time requirements

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Summary

Introduction

Trends in the printed circuit board (PCB) industry are obviously affected by the requirements of the manufacturers of computers, communication equipment, and consumer electronics. The price pressure has increased in recent years. Reducing the manufacturing cost is very important. This research focuses on the manufacturing process of prepreg of copper-clad laminate (CCL) which is the core element of a PCB. Different prepregs are required for different specifications of base material or copper clad laminate. Companies have to produce various specifications of prepreg to satisfy customers’ needs

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