Abstract
An efficient electro-thermal simulation based on parallelized alternating-direction-implicit (ADI) method is presented for transient analysis on-chip interconnects. Both temperature-dependence of electrical resistivity and Joule heating effect are taking into account in the modeling. With the ADI technique, the heat conduction equations can be calculated with linear computational complexity. The open multi-processing (OpenMP) application program interface (API) is employed for the parallel implementation of the ADI approach, which improves the computational efficiency significantly. The accuracy and high parallel efficiency of the proposed method are demonstrated by the numerical examples.
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