Abstract

AbstractThe objective of this work was to elucidate the influence of particle size on the mechanical spectra of jackfruit seed flour (JFSF) dough (JFSF/water = 1:2) before and after the nonisothermal (NIH) heating from 50 to 105°C. The jackfruit seeds (Artocarpus heterophyllus L.) were ground into flour and separated based on particle sizes (595, 297, 149, 105, 74, and 63‐μm). The particle size distribution of flour was measured by the laser light scattering. The mechanical rigidity of the dough samples assessed by a rheometer. The maximum weight percentage of particles (44.19%) were passed through 297‐μm while the 90% volume distribution of particles was 217.7‐μm. The peak temperature (Tp) of the dough produced from the selected particle fractions (297, 149, and 74 μm) decreased linearly with increasing the fineness during the NIH. At 25°C, the frequency sweep test demonstrated that the mechanical rigidity of doughs increased in the order of 297‐μm > whole > 149‐μm > (297 + 74)‐μm > 74‐μm, however, those values reversed after the heat/cool process except for the whole flour sample. The results could be useful to select the particle size of JFSF to achieve a desired consistency in the product during thermal processing.Practical ApplicationsSize reduction is an important unit operation in the food industry. It has many industrial benefits including convenience, removal of undesired materials, and improve the reactivity with increased surface area. Jackfruit seeds are waste material. Production of flour from jackfruit seeds followed by size reduction could introduce a new ingredient in the market with unique functionality and applications. The flour has potential for the development of gluten‐free products and dough thickener.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.