Abstract
The present study reports the feasibility of the Wire Arc Additive Manufacturing (WAAM) process to fabricate pure copper (Cu) wall structures. The process parameters that gave continuous tracks without any porosity and micro-cracks are used for layer-by-layer wall structure deposition. The scan and build direction have a UTS of 226.89 ± 4.28 MPa and 219.35 ± 1.41 MPa, along with an enhanced percentage elongation of 124.47 ± 8.65 % and 99.64 ± 16.47 %, respectively.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
