Abstract
The semiconductor industry plays an integral role in Taiwan's manufacturing sector. Although defect reduction has received considerable attention to improve the yield rate, the problem of optimizing wafer exposure patterns has seldom been addressed. This study formulates the wafer exposure‐patterning problem into a cutting and packing problem by adopting an innovative approach. We developed a two‐dimensional cutting algorithm to maximize the number of dies that can be produced from a wafer to increase the gross die yield. The proposed algorithm is successfully implemented in a wafer fabrication factory. Experimental results validate the effectiveness of the proposed algorithm.
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