Abstract

A 640 Gb/s high-speed ATM switching system that is based on the technologies of advanced MCM-C, 0.25 /spl mu/m CMOS and optical WDM interconnection is fabricated for future B-ISDN services. A 40-layer, 160 mm/spl times/114 mm ceramic MCM realizes the basic ATM switch module with 80 Gb/s throughput. The basic unit ATM switch MCM-C consists of an 8-chip advanced 0.25 /spl mu/m CMOS VLSI and 32 chip I/O bipolar VLSIs. The MCM employs a 40 layer, very-thin-layer ceramic MCM and a uniquely structured closed loop type liquid cooling system is adopted to cope with the MCM's high-power dissipation of 230 W. The MCM is mounted on a 32 cm/spl times/50 cm mother board. A three-stage ATM switch is realized by optical WDM interconnection between the high-performance MCMs. For WDM interconnection, newly developed compact size 10 Gb/s, 8 WDM optical transmitters and receivers are used. An optical WDM router based on an AWG (Arrayed WaveGuide) router is used for mesh interconnection of boards. The optical WDM interconnect has 640 Gb/s throughput and easy, simple interconnection. The system, MCM, and optical WDM interconnection will be applied to future B-ISDN backbone networks.

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