On the Design of Laser Structured Ka Band Multi-Chip Module

Abstract

The rapid prototyping of millimeter wave (MMW) multi-chip module (MCM) on low-cost ceramic-polymer composite substrate using laser ablation process is presented. A Ka band MCM front-end receiver is designed, fabricated and tested. The complete front-end receiver module except the IF and power distribution sections is realized on the single prescribed substrate. The measured receiver gain, noise figure and image rejection is 37 dB, 4.25 dB and 40 dB respectively. However, it deduced from the experimental results of the two front-end modules that the complex permittivity characteristics of the substrate are altered after the laser ablation process. The effective permittivity alteration phenomenon is further validated through the characterization and comparison of various laser ablated and chemically etched Ka band parallel-coupled band-pass filters. A simple and experimentally verified method is worked out to utilize the laser ablation structuring process on the prescribed substrate. It is anticipated that the proposed method can be applied to other laminated substrates as well with the prescribed manufacturing process. DOI : http://dx.doi.org/10.11591/telkomnika.v12i2.3775