Abstract

Reverse halo implantation (RHI), for the first time, is introduced and used to fabricate MOSFETs. It was demonstrated that RHI can dramatically improve short-channel effect, which can be used to enhance MOSFET performance, improve process control, or reduce stand-by power consumption. Implantation damage of RHI to gate oxide is negligible. The method of RHI is economic and suitable for massive manufacturing of very large scale integration

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