Abstract
The analysis of the reasons causing degradation observed in resist layer during selective gold plating on patterns for MIC's has resulted in an excellent combination of electrolytic bath and photoresist type. Thick layers of gold (i.e. more than 10 μm) have been deposited by the method presented here over a period of about 1 h without any deterioration in the photoresist property. This combination can be used in the fabrication of beam lead devices with better results.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
