Abstract
To study the bending characteristics of copper alloy thin plate by single pulse laser, the thermal mechanical coupling model of pulsed laser forming (PLF) was established; the dynamic change and steady distribution for the fields of temperature, stress& strain and displacement were analyzed. The results show n that during the pulse laser heating stage, the temperature gradient along the thickness direction is far less than that of the heat affected zone; due to the constraints of materials around the heating field, the compressive stress and negative strain are appeared, the cantilever end of sample produces warping deformations; in the cooling stage, the temperature of top and bottom surface material drops rapidly, the sample is with a negative bending and reduced deformation. This is related to the transferring of the stress change and the recovery of part of the elastic deformation in heating area.
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