Abstract
A numerical study in 3-D is performed using water as a cooling fluid to investigate the one phase natural convection heat transfer within enclosure. A heat source representing a computer CPU mounted on one vertical wall of a rectangular enclosure is simulated while a heat sink is installed on the opposite vertical wall of the enclosure. The air flow inside the computer compartment is created by using an exhaust fan, and the flow is assumed to be turbulent. The applied power considered ranges from 15 – 40 W. In order to determine the thermal behaviour of the cooling system, the effect of the heat input and the dimension of the enclosure are investigated. The results illustrate that as the size of the enclosure increase the chip temperature declined. However the drop in the temperature is very small when the width increased more than 50 mm. When the enclosure was filled with water the temperature was reduced by 38%. Also the cooling system maintains the maximum chip temperature at 71.5 °C when the heat input of 40 W was assumed and this is within the current recommended computer electronic chips temperature of no more than 85°C.
Highlights
The natural convection is considered as an effective and most economical cooling strategy for computer electronic devices [1]
A heat source representing a computer CPU mounted on one vertical wall of a rectangular enclosure is simulated while a heat sink is installed on the opposite vertical wall of the enclosure
The results of natural convection inside rectangular enclosures filled with air to cool electronic chips show the limitation of air natural convection cooling [3]
Summary
The natural convection is considered as an effective and most economical cooling strategy for computer electronic devices [1]. There is a promising alternative way to keep the electronic devices at the safe operation temperature by using liquids This is justified by the fact that the liquids have relatively high removal of heat when compared to air. Numerical and experimental studies were carried out by Heindel et al [8] where two different coolant fluids (water and FC-77) were used within the enclosure to cool heaters where the cold wall is fixed at room temperature. They concluded that as the heat flux increases, the convection coefficients along the heater face and vertical velocity
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