Abstract
ABSTRACTThe use of load-displacement derivative behavior and power-law curve fitting is applied to find the location of events for a number of different materials during depth-sensing indentation. Load-displacement curves for Berkovich indentations on fused silica, fullerene thin film on sapphire, CdTe thin film on silicon, single crystal silicon, carbide derived carbon, and a polymethylmethacrylate/hydroxyapatite (PMMA/HA) particle composite are examined. The analysis is applied to quantify the location of different events that occur during material loading and unloading.
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