Abstract
AbstractWe investigated improvement of workability (viscosity), storage stability, and curing ability of thiirane resin for adhesive applications. The viscosity of bisphenol‐F thiirane resin was lower than that of bisphenol‐A thiirane resin, especially at low temperatures, thus improving ease of handling. Addition of diphenyl decyl phosphite improved its storage stability to a level similar to that of bisphenol‐A epoxy resin. The curing of bisphenol‐F thiirane resin increased three times faster by adding 2,4,6‐tris(dimethylaminomethyl)phenol (DMP‐30) as a tertiary amine. In applications of this new thiirane resin as civil and architectural adhesives, a superior curing ability at low temperature was attained. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 82: 2953–2957, 2001
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