Abstract
This paper is to present a novel and easy fabrication method for suspended high-aspect-ratio parylene structures on a standard silicon wafer. The process employs the concept of creating parylene beams by multiple parylene deposition/removing steps in the trench, releases the structures at the same side of the silicon wafer, and then fabricates soft beams for the requirement of high sensitivity and low stiffness in in-plane motion. By using the proposed process, a test device of free-standing parylene beams with 20 μm in width, 3000μm in span, and 50μm in thickness is fabricated to verify the feasibility of the suspended parylene-based structure design.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
