Abstract
A novel electroless plating process for preparing a copper film on aluminum nitride (AlN) was developed. This process relies on uniform coating of Cu 2 O particles onto AlN substrate followed by annealing to form compositeoxide layer and Cu particles as the seed for initiating the electroless copper deposition, instead of using Pd catalyst in a conventional electroless plating process. The adhesive strength measured by peel test was more than 4 kg per 2 X 2 mm square (kg/4 mm 2 ), much greater than that obtained using conventional electroless plating process. The use of CU 2 O particles is crucial in this novel process for direct interconnection between deposited Cu film and AIN substrate, and the composite oxide layer formed after annealing is suggested to be responsible for high adhesive strength obtained.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
