Abstract
Acousto-Ultrasonic (AU) nondestructive evaluation of finger joints in structural lumber has been conducted to evaluate the adhesive bond strength using the stress wave factor (SWF) measurement technique. The strength of the finger joints was then evaluated using the commonly used destructive tensile test method. It was observed that higher values of the SWFs correspond to higher values of the tensile strength data. These results show that the AU approach has the potential of being used in quality assurance of the adhesive bond strength of finger joint connections
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