<title>New metrology stage for ion projection lithography made of glass ceramics</title>

Abstract

In the next few years a new chip-generation with structure sizes well below 100 nm and high complexity will require novel, so-called 'future lithography' processes. One of these new technologies is the Ion Projection Lithography. Within the framework of a large European project lead by SIEMENS, the necessary technologies are developed and the first pilot system will be built. In this system, one of the most important units is a high precision wafer stage. The heart of the stage system is the so-called metrology - plate with integrated electrostatic wafer chuck and handling unit. The design of this novel stage system is described in this contribution. Extensive FEM-simulations from the basis of the present design. All major components are made from glass-ceramics to guarantee the highest possible thermal and mechanical stability. Not only in the field of lithography many modern precision mechanical systems require position tolerances in the sub-micrometer and seconds of arc range. Strong systems solutions can be developed by the effort of glass-ceramics and new and traditional manufacturing processes.