Abstract
This paper describes the performance characteristics of a new class of electronic molding compounds for semiconductor encapsulation. These new materials are identified as silicone-epoxy hybrid polymers. They were evaluated by testing integrated circuits molded in the hybrid system and comparing these results with those obtained with current state-of-the-art commercial silicone and epoxy molding compounds. Results are given for long-term life testing under environmental conditions of high temperature/high humidity and salt atmosphere. Temperature humidity bias data on linear integrated circuits tested by a semiconductor manufacturer are also presented. The effects of temperature and humidity on the molded plastic as measured by moisture absorption and dimensional stability are shown.
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