Abstract
This paper focuses on the challenges and new developments in chemical mechanical planarization (CMP) pad conditioner technology for the next-generation applications, with a special emphasis on the comparative performance characterization of pad conditioners. Empirical data from a number of case studies are presented. Different design 4" disk pad conditioners were evaluated using a benchtop polisher, a benchtop tribometer, and a 300 mm wafer polisher/tribometer to determine pad cut-rate, pad surface roughness, coefficient of friction (COF), and Cu polishing behavior. Results are presented for the effect of pad conditioner design parameters, including abrasive/feature size and distribution, on the pad cut-rate and pad surface roughness. Such information may be helpful in reducing the fab selection and optimization time for pad conditioners in advanced technology node applications. Present study demonstrates the usefulness of pad conditioner laboratory scale characterization.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
