Abstract

In the present paper, we describe the mechanisms of photo- and radiation-induced reactions in silicon based resist materials, polysilanes with Si-branchings and Si–H bondings, candidates for future resist materials. Polysilanes have been previously confirmed to show positive-type resist properties for ultra violet (UV) light, electron beams (EB), and X-rays under all conditions. However, the cross-linking reaction of the polymer became dominant in the polysilane with Si-branchings, upon irradiation with UV light, EB, and ion beams. The efficiency of the cross-linking reaction strongly depended on the ratio of Si-branching producing polymer gels in the polysilane with a higher amount of Si-branching than 5%, even with γ-ray irradiation. Polyhydrosilanes containing vinyl groups were revealed to cause efficient cross-linking reactions in the presence of catalysts for hydrosilylation upon exposure to deep UV or X-rays, leading to high-sensitive negative resist materials for extreme UV lithography.

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