Abstract
Compressible Micro-Interconnect (CMI) shows tremendous potential in 2.5D/3D heterogeneous integration due to its outstanding performance in integration, electrical isolation, and thermal management. In this work, an optimal design approach for CMIs is developed based on a coupling framework of multiphysics simulation and particle swarm optimization (PSO). In the framework, the mechanical simulation was conducted firstly to obtain the stress distributions as CMI switched from the initial state to the working position. The contact resistance between CMI and the top pad was modeled and quantitively analyzed. Subsequently, the PSO method was utilized to implement the structural optimization of CMI to improve the performance. Multiphysics simulations of both the original and optimized CMIs were carried out and compared. With the implementation of the optimized CMIs, the contact resistance dropped from 155.3 mΩ to 108.8 mΩ, which brought significant improvement in both DC voltage drop and self-heating effect. The influence of the self-heating effect on the electrical performance of CMI is also discussed qualitatively.
Highlights
With the fast-approaching limit of Moore’s law, three-dimensional (3D) heterogeneous integration technology was proposed as an alternative solution to improve the integration density and the system performance [1]
Solder bump was an indispensable component for systematic interconnection, and it could realize an electrical connection between different circuits or packaged integrated circuits (ICs)
Once the upper die or core is mounted, the Compressible Micro-Interconnect (CMI) is deformed and only a sole edge is attached to the pad, which leads to a small area of electrical contact and, a large contact resistance
Summary
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