Abstract
It has been shown that an under-layer of SiO2 · nH2O on a silicate glass surface, promotes the adsorption of Sn(II) hydroxycompounds, resulting in the formation of Sn–O–Si chemical bonds. It also: contributes to the formation of monodispersed Sn(II) compound nanoparticles; levels the glass surface micro-relief; ensures the deposition of fine-grained metal films; increases the rate of Ni–P and Cu electroless plating; and increases the rate of the adhesion interaction between the surface of the silicate glass and metal films. It opens up the possibility of electroless and electrochemical plating of 5–10 μm thick multilayer metal and alloy films.
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