Multidisciplinary Collaboration Methodology for Smart Perception System-on-a-Chip (SoC)

Abstract

Smart Perception System-on-a-Chip (i>SoC) i>systems that sense, receive, transmit, and process signals are the i>eyes and ears in the millennium's need of information fusion and embedded intelligence. For intelligent fusion, the process of storing and analyzing the signals acquired from these i>smart perception systems involves the interoperability of mixed-signal systems. Embedded intelligence involves the collaborative blending of mixed-signal systems with the multidisciplinary areas of mixed-technology domains (electrical, mechanical, optical, thermal, biochemical) and mixed-concept performance (electrical, control, digital signal processing). Collaboration of mixed-signal design differences, impose robust design challenges for multidisciplinary design methodology. Integrating application-specific signal processor cores, memory, analog and i>MEMs functions on the same monolithic chip of silicon involves unique collaborative design methodology in both the macro and micro arenas. Macro collaborative automation tools reflecting rapid prototyping techniques, enabling teams of designers to work together from remote sites is today's realization. Micro collaborative approaches in i>SoC submicron manufacturing capability, requires advances in interoperability simulation technology, hardware description languages, design analysis tools, model availability and accuracy, physical design tools, design synthesis tools, pre-developed and tested libraries of intellectual property, design advisors and test generators is tomorrow's future. At present, no micro collaborative design environment is capable of this methodology. Establishment of cross-tool interoperability design interchange standards that can bridge the gap between future and present collaborative design methodology and reduce the cost of i>SoC design and design time is required.