Abstract
In this paper, a new type of multi-scale porous copper foams was developed by composite electroplating and subsequent heat treatment. They contain macro pores and finer or micro ones with pores size of about 300μm and 5–20μm respectively, performing different functions in a capillary action when they are used in thermal management devices such as heat pipe, vapor chamber etc. The large pores help reduce the resistance to liquid flow and accommodate more liquid, and the small pores enhance the capillary performance. In comparison with the manufacturing processes for traditional wick structures such as sintered metal powders, meshes or micro channels, the multi-scale porous copper foams are more advantageous as they are more cost effective and can be done at a higher production rate.
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