Abstract
Abstract: Nowadays, with the rapid growth in electronic devices, compact and efficient heat sinks are required in day-to-day life. That’s why it's need to be use optimized heat sinks. The excess heat generated causes damage in different parts also generates major problems in the system. So, in this work three-dimensional square channel of copper material is used to study heat transfer coefficient and pressure drop. The comparative numerical analysis of thermal management system different parameter like coolant fluid, inlet velocity of fluid, shape of obstacles, aspect ratio of obstacles and number of obstacles is presented in this paper. Analysis and optimization of the heat sink are done by three different methods i.e., experimental, analytical, and simulation. In this work analytical and simulation method is used for the optimization of a heat sink. There are many software’s are available for analysis and optimization, by using the “COMSOL Multi-physics software” we optimize multi objectives heat sink. After analytical and numerical analysis, to optimize best result Taguchi method is preferred, for that MINITAB software is used. Keywords: Heat transfer coefficient, pressure drop, micro heat sink, Taguchi method, Analysis, optimization, COMSOL Multiphysics software, MINITAB software.
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