Morphology, thermal and mechanical performance of epoxy/polysulfone composites improved by curing with two different aromatic diamines

Abstract

AbstractEpoxy/polysufone (PSF) composites cured with 4,4'‐diaminodiphenyl sulfone (DDS) and 4,4'‐diaminodiphenyl methane (DDM) were fabricated, and the effect of dual curing reaction of diamines with epoxy on morphology, mechanical, and thermal performance was investigated. DSC results indicated that DDM was more reactive than DDS and the activation energy decreased with the rising of DDM content. Structures with small domain size at the early stage of phase separation were fixed by the fast epoxy‐DDM reaction. When the DDM content was elevated to a high level, large dual structures were changed to fine bicontinuous structures, which was favorable to improve the mechanical property. The mechanical performance of epoxy composites was enhanced and the maximum values were achieved when the DDM/DDS ratio was located at 75/25 (PSF/DDS0.25‐DDM0.75). The flexural and tensile strength relative to epoxy/DDM system were enhanced more than those relative to epoxy/DDS, while the increase in toughness was the opposite. TGA measurement showed that thermal stability of epoxy/PSF composites was improved because of the restricting effect of continuous PSF domains on thermal motion of epoxy. DMA analysis exhibited two relaxation peaks for PSF/DDS0.25‐DDM0.75, which could be attributed to the formation of phase separated morphology and epoxy network with different cross‐link density.